Comparison ledger
EV Group 101, SUSS MicroTec MA6/MA4, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA6/MA4SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | wafers up to 4″ (MA4) or 6″ (MA6); also 1 cm² pieces |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA6/MA4 |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[2] | — |
| Model | 101[2] | — |
| Equipment name | EVG 101 Spray Coater[2] | — |
| NEMO ID | evgspraycoat[2] | — |
| Training required | EVG 101 Training[2] | — |
| Training duration | 1.50 hours[2] | — |
| Processing technique | Resist Spray Coat (manual)[2] | — |
| Cleanliness | "All"[2] | — |
| Location | SNF Paul G Allen L107 Cleanroom[2] | — |
| Wafer diameter (substrate size) | up to 300 mm[3] | — |
| Available modules | Spin coat / OmniSpray® / develop[3] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[3] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[4] | — |
| Cleanliness group (at SNF) | "All"[2] | — |
| Exposure resolution | — | < 1 µm[1] |
| Alignment accuracy | — | Topside – 500 nm[1] |
| Exposure modes | — | Hard contact, soft contact, proximity, flood[1] |
| Spectral range | — | 365 nm – 405 nm[1] |
| Substrate accommodation | — | 1 cm² pieces and wafers up to 4″ (MA4) or 6″ (MA6)[1] |
| Uniformity | — | +/- 5% over exposure area[1] |
| Image capture | — | CCD camera and monitor[1] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →