Comparison ledger
EV Group 101, Veeco AP 300 E Lithography, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | AP 300 E LithographyVeeco |
|---|---|---|
| OEM | EV Group | Veeco |
| Category | Lithography | Lithography |
| Wafer size | — | Warped Wafer Handling to 500 um |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Veeco AP 300 E Lithography |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | — |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | 2.0 um Resolution, Extended Field, ghi-line Broadband Lens Dual 1200 Watt Lamp llluminator[4] |
| Universal Size/Warped Wafer Kit | — | 200 mm and 300 mm[4] |
| Wafer size | — | Warped Wafer Handling to 500 um[4] |
| Dual Flip Aperture | — | ([68mm/44mm/34.2mm] x 26mm)[4] |
| Power Source | — | 208 V three phase, 5 wire, 150 amp[4] |
| Resolution | — | 2.0 µm[4] |
| Optics | — | extended-field, ghi-line broadband lens[4] |
| Illuminator | — | Dual 1200 Watt Lamp Illuminator[4] |
| Field size | — | 68 x 26 mm[4] |
| Warped wafer handling | — | to 500 um[4] |
| Alignment system | — | PATMAX MVS Alignment System[4] |
| MVS alignment spectrum | — | 530 - 570 nm[4] |
| Reticle stack | — | 6 slot, manual front loading[4] |
| Reticle type | — | 6 x 6 x 0.25 inch[4] |
| Wafer handling | — | Universal Size/Warped Wafer Kit: 200 mm and 300 mm[4] |
| Wafer thickness handling | — | 0.4 mm to 2.0 mm[4] |
| Edge exposure system | — | WEE 3[4] |
| Edge exclusion system | — | one exclusion ring; exclusion ring width 1 - 5 mm protection available[4] |
| Communications | — | GEM HSMS[4] |
| Auto filter changer | — | ghi-line auto filter changer[4] |
| Open cassette adapter | — | QTY 2[4] |
| Environmental chamber | — | shipped from supplier (white)[4] |
| Lens protection | — | requires closed loop cooler[4] |
| Lens distortion reference | — | no lens matching[4] |
| Closed loop cooler | — | included[4] |
| Enhanced bottom pellicle | — | included[4] |
| Gen 4 Fanout 300 | — | 300mm wafer size only[4] |
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