Comparison ledger
EV Group 501 Wafer, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 501 WaferEV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 501 Wafer | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Wafer size | Manual wafer load substrate bonder[1] | — |
| Configuration | Capable of fusion compression bonding[1] | — |
| Max Bond Force | 7 kN[1] | — |
| Top side heater | 550°C max. in 1°C steps[1] | — |
| Bottom side heater | 550°C max. in 1°C steps[1] | — |
| Temperature uniformity | ± 1,5 %[1] | — |
| Wafer sizes | 2, 3, 4, 5, 6 inch (up to 150 mm)[1] | — |
| Substrate size | single chips to 200 mm[2] | — |
| Max bond force | 7 kN (source 1) or up to 20 kN (source 2)[1] | — |
| Top side heater max temperature | 550°C in 1°C steps (source 1)[1] | — |
| Bottom side heater max temperature | 550°C in 1°C steps (source 1)[1] | — |
| Maximum temperature (source 2) | up to 450°C[2] | — |
| Vacuum (standard) | 1x10-1 mbar[2] | — |
| Vacuum (optional) | 1x10-5 mbar[2] | — |
| Power supply for anodic bonding | 0-2000 V, 0-50 mA[2] | — |
| Footprint | 0.8 m2[2] | — |
| Conversion time | less than 5 minutes[2] | — |
| Control software | Windows-based[1] | — |
| Wafer Size | — | 6 inch[3] |
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