Comparison ledger
EV Group 850 Wafer, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 WaferEV Group | 10490West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 850 | West Bond 10490 |
| Specifications | ||
| Configuration | 50/60 Hz[1] | — |
| Power Consumption | 28,9 kW[1] | — |
| Full Load Current Rating | 89,1 A[1] | — |
| Largest Current Rating | 28,9 A[1] | — |
| Power | 5.5 kW[2] | — |
| Voltage | 120/208 V, 3 Phase[2] | — |
| Manufacturer | EVG[1] | West Bond[3] |
| Model | 850 Wafer[1] | 10490[3] |
| Category | Packaging & Bonding[1] | — |
| Wafer sizes | 2, 3, 4, 5, 6, 8, 12 inch[1] | — |
| Wafer size limit | up to 8 inch[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Vintage | 2001[2] | — |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →