Comparison ledger
Finetech Lambda, MRSI HVM3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LambdaFinetech | HVM3MRSI |
|---|---|---|
| OEM | Finetech | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2018– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2019 Name change |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Lambda | MRSI HVM3 |
| Cited variants |
| |
| Specifications | ||
| Accuracy | 0.5 um[4] | — |
| Configuration | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[4] | — |
| Power | 80W Contact Chip Heater (CCH) with a single heated tool[4] | — |
| Placement Accuracy | 0.5 μm (sub-micron)[4] | — |
| Bond Force Range | 0.2-20 N[4] | — |
| Heating Plate Size | 50 × 50 mm[4] | — |
| Side Process Camera | Included[4] | — |
| Y Axis Camera Shifter | Included[4] | — |
| Fine Theta Adjustment on Bond Head | Included[4] | — |
| Dispense Syringe Mount Hardware | Included (no controller)[4] | — |
| Operating System | Windows 10 Pro[4] | — |
| Bonding Technologies | Thermocompression and ultrasonic[6] | — |
| Inert/Process Gas Enclosure | Included (on asset 153908)[5] | — |
| XY & Coplanarity Calibration Kit | Included (on asset 153908)[5] | — |
| Software | Finetech Software[4] | — |
| Placement Accuracy (description) | sub-micron[6] | — |
| Heating Plate | 50 x 50 mm with Gel/Waffle Pack station[4] | — |
| Control System | Windows 10 Pro PC[4] | — |
| Fine Theta Adjustment | Present on bond head[4] | — |
| Dispense Syringe Mount | Hardware only (no controller)[4] | — |
| Bond Line Adjust/Control Module | Present[4] | — |
| Contact Chip Heater | 80W (CCH) with single heated tool[5] | — |
| Substrate Heater (optional) | 100 x 100 mm with Gel/Waffle Pack station[4] | — |
| Placement accuracy | Sub-micron placement accuracy[6] | 3 microns, 3 sigma, true radial placement (depending on application)[7] |
| Bond technologies | Thermocompression and ultrasonic technologies[6] | — |
| Heating plate | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[4] | — |
| Bond force range | 0.2-20N Bond Force Module[4] | — |
| Bond head theta adjustment | Fine Theta Adjustment on Bond Head[4] | — |
| Vision | Side Process Camera[4] | — |
| Camera shifter | Y Axis Camera Shifter[4] | — |
| Adhesive dispensing hardware | Dispense Syringe Mount Hardware – no controller[4] | — |
| Process gas enclosure | Inert/Process Gas Enclosure[5] | — |
| Contact chip heater | 80W Contact Chip Heater (CCH) with a single heated tool[5] | — |
| Calibration kit | XY & Coplanarity calibration kit[5] | — |
| Control PC | Windows 10 Pro PC, Keyboard, Mouse & Monitor[4] | — |
| Bond line control | Bond Line Adjust/Control Module[4] | — |
| Application | — | Microwave modules, hybrid, optical modules, epoxy and eutectic die bonding[7] |
| Placement repeatability | — | ≤ 1 micron[7] |
| XY motors | — | Brushless DC linear motors with glass-scale encoder resolution of 50 nm[7] |
| X travel | — | 17.5 in (444.5 mm)[7] |
| Y travel | — | 36.0 in (914.4 mm)[7] |
| Z travel | — | 1.5 in (38.1 mm)[7] |
| Theta travel | — | 360°[7] |
| Theta resolution | — | 0.0045°[7] |
| Pressure control | — | 10 g to 5 kg per placement[7] |
| Cameras | — | 2 down-looking cameras sharing an optical path; 1 up-looking camera[7] |
| Vision system | — | Edge detection and pattern recognition[7] |
| Lighting | — | Red, green, and blue; ring or coaxial illumination; programmable intensity[7] |
| Pickup nozzles | — | 13 in standard nozzle changer; multiple changers optional; can also carry epoxy dispensing heads[7] |
| Waffle packs | — | Up to 72 2 x 2 in waffle packs (50.8 x 50.8 mm) or Gel-Paks™ or 4 x 4 in (101.6 x 101.6 mm)[7] |
| Tape and reel feeders | — | Up to ten 8 mm tape and reel feeders[7] |
| Eutectic bonding | — | Programmable ramp rate; maximum temperature 450°C[7] |
| Process gases | — | Nitrogen, argon, N2-H2, or Ar-H2[7] |
| Dispense pumps | — | 2 syringe rotary screw pumps or time/pressure-controlled pumps[7] |
| Dispense height sensing | — | 3-point laser height mapping of the substrate plane[7] |
| Dispense needle cleaning | — | Automated programmable cleaning between pattern dispense intervals[7] |
| Dispense needle calibration | — | Automatic software calibration using beam sensor[7] |
| Repeatability | — | ≤ 1 µm[7] |
| Minimum chip size | — | 0.008 sq. inch (200 sq. micron)[7] |
| Illumination | — | RGB; ring or coaxial; intensity programmable[7] |
| Eutectic temperature | — | up to 450ºC[7] |
| Minimum placement force (closed loop) | — | 10 g[7] |
| Maximum placement force (closed loop) | — | 5 kg[7] |
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