Comparison ledger
Finetech Sigma, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SigmaFinetech | 10490West Bond |
|---|---|---|
| OEM | Finetech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Sigma | West Bond 10490 |
| Specifications | ||
| FPXvision | High resolution magnification[1] | — |
| Placement accuracy | Sub-micron (0.5 µm on 300 mm wafer)[1] | — |
| Substrate size | Up to 300 mm[1] | — |
| Bonding force range | 0.2 to 1000 N (up to 1000 N)[2] | — |
| Working area | 450 x 150 mm[3] | — |
| Vacuum chamber pressure (option) | 10^-3 hPa[2] | — |
| Year of introduction (European premiere at Expoelectronica) | 2016[2] | — |
| Manufacturer | — | West Bond[4] |
| Model | — | 10490[4] |
| Description | — | Convertible bonder, wedge to ball[5] |
| Tool type | — | Convertible bonder[6] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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