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Comparison ledger

1 EC 101 R 485 Photoresist SpinnerversusDelta 12 AQ

Headway 1 EC 101 R 485 Photoresist Spinner, SUSS MicroTec Delta 12 AQ, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Delta 12 AQSUSS MicroTec
OEMHeadwaySUSS MicroTec
CategoryResist ProcessingResist Processing
Wafer size—Wafer Developing System Configuration
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeadway 1 EC 101 R 485 Photoresist SpinnerSUSS MicroTec Delta
Specifications
Vacuum requirement23" Hg[1]—
Electrical115 V, 3 A, 50/60 Hz, 1 Ø (single phase)[1]—
Electrical power115 V, 3 A, 50/60 Hz, 1 Ø (single phase)[1]—
Configuration—Software is not included[2]
Maximum wafer diameter—200 mm (8 in)[3]
Maximum substrate thickness—5 mm[3]
Supported wafer diameters—50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[3]
Supported photomask sizes—125 mm x 125 mm, 150 mm x 150 mm[3]
Supported developer chemistries—AZ400K, AZ300MIF, CD26[3]
Process type—temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[3]
Operation control—Recipe controlled automated operation with precise temperature control[3]
Wafer size—Wafer Developing System Configuration
Vintage—2009
Coaters & Developers Vintage—2009
Development method—temperature controlled spray development[3]
Operation mode—cassette-to-cassette, recipe controlled[3]
Small pieces supported—No[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]nist.govnist.gov