Waferpedia

Comparison ledger

1088versus1809 MK III

Heller 1088, Heller 1809 MK III, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMHellerHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Heller 1809
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[1]—
Heating MethodForced convection[1]—
Conveyor Width18 inches (45 cm)[1]—
Heated Length43.5 inches (111 cm)[1]—
Overall Length96 inches (244 cm)[1]—
Height50 inches (127 cm)[1]—
Net Weight900 lbs (409 kg)[1]—
Thermal ProfilerIncluded[1]—
Oven TopCounter balance for easy access to conveyor[1]—
Solder CompatibilityLead-free and leaded soldering[1]—
Configuration—50/60 Hz[2]
Voltage—220 V[2]
Largest Heater Load—13 A[3]
Short Circuit interrupting Capacity—5000 A[3]
Equipment type—Reflow oven[2]
Electrical specification—50/60 Hz, 220 V[2]
Control system—Windows 8.1[3]
Option—Includes edge rail support option[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com
  2. [2]inventory listing
  3. [3]inventory listing