Waferpedia

Comparison ledger

BJ 820versus10100

Hesse & Knipps BJ 820, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
BJ 820Hesse & Knipps
10100West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps BJ 820West Bond 10100
Specifications
Voltage230 V[1]—
Configuration50-60 Hz[1]—
TypeWire bonder[1]—
ModelBJ 820[1]—
Electrical230 V, 50-60 Hz[1]—
Bond head45-degree bond head[3]—
Included itemsMicroscope, monitor, vacuum work holder[3]—
Vintage2005[3]—
Equipment typeWire bonder[1]—
Electrical rating230 V, 50-60 Hz[1]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing