Waferpedia

Comparison ledger

Bondjet 820versus10100

Hesse & Knipps Bondjet 820, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Bondjet 820Hesse & Knipps
10100West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps Bondjet 820West Bond 10100
Specifications
PowerU 230V[1]—
Configuration50/60 Hz[1]—
Voltage230 V[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing