Waferpedia

Comparison ledger

2060 Pick and Place PartsversusMY 12

Juki 2060 Pick and Place Parts, Mydata MY 12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MY 12Mydata
OEMJukiMydata
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyJuki 2060 Pick and Place PartsMydata MY 12
Specifications
ConfigurationFor Parts Only[1]50/60 Hz[2]
Type—pick and place machine[3]
Category—Assembly / SMT[3]
Power / electrical—50/60 Hz[3]
Placement rate, standard performance—6,500 CPH[4]
HYDRA Speedmount placement rate on chips—21,000 CPH[4]
Linescan Vision System placement rate on fine-pitch components—6,100 CPH[4]
Accuracy—Repeatability of 15 mm at 3 sigma[4]
Feeder capacity—144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[4]
Rated speed—21,000 CPH IPC 9850 chip net throughput 17,500 CPH[5]
Fine-pitch rated speed—6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[5]
Board handling: maximum board size—384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[5]
Machine size—3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[5]
Weight—2100 kg[5]
Power requirements—Three phase AC 6.6 kVA (3 x 2.2 kVA)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]ibesmt.comibesmt.com
  5. [5]as-equipment.deas-equipment.de