Waferpedia

Comparison ledger

IConn MEM Plusversus10100

Kulicke & Soffa IConn MEM Plus, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
IConn MEM PlusKulicke & Soffa
10100West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa IConn MEM PlusWest Bond 10100
Specifications
Ultra Fine Pitch35 μm[1]—
Gold wire diameter0.6 mil to 2.0 mil[1]—
Silver alloy wire diameter0.6 mil to 2.0 mil[1]—
Bonding Area (X)56 mm[1]—
Bonding Area (Y)80 mm[1]—
Total Bond Placement Accuracy2.0 μm @ 3 sigma[1]—
Maximum Wire Length (1.0 mil wire)7.6 mm[1]—
Maximum Wire Length (0.6 mil wire)3.0 mm[1]—
Minimum Loop Height (0.6 mil wire)40 μm[1]—
Input Voltage200-240 VAC, single phase, 50/60 Hz[1]—
Power Consumption (nominal)1.5 KVA[1]—
Power Consumption (max)2.6 KVA[1]—
Footprint889 mm x 1009 mm (35" x 39.7")[1]—
Weight (machine only)620 kg (1367 lbs)[1]—
Minimum Air Pressure3.52 kg/sq cm (50 psi)[1]—
Nominal Air Consumption185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)[1]—
Cover Gas Consumption (nominal)0.9 liters/min[1]—
Setup Time (same leadframe type)< 4 min[1]—
Setup Time (different leadframe type)< 8 min[1]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]elexind.itelexind.it