Waferpedia

Comparison ledger

2300 V 2 Versys Kiyo 45 Polysiliconversus100 ICP Fluorine

Lam Research 2300 V 2 Versys Kiyo 45 Polysilicon, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 2300 V 2 Versys Kiyo 45 PolysiliconOxford Instruments 100 ICP Fluorine
Specifications
MakeLam[1]—
Model2300 V 2 Versys Kiyo 45[1]—
Wafer Size12 inch[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu