Comparison ledger
Lam Research 2300 Versys Kiyo Polysilicon, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 Versys Kiyo PolysiliconLam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 Versys Kiyo Polysilicon | Oxford Instruments 100 ICP Fluorine |
| Cited variants |
| — |
| Specifications | ||
| Wafer Size | 300mm (12 inch)[2] | — |
| Application | Polysilicon Etch[3] | — |
| Configuration (Kiyo 2300 V2) | 4 Kiyo CX chambers, 3 load ports, ATM robot with one end effector, VTM robot with dual end effectors, software version SP15-HF6, communication protocols RS232 and LON[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[4] |
| Cryo DRIE etch rate | — | up to 5 µm/min[4] |
| Wafer size | — | 4 inch, 6 inch, 8 inch (with clamp change)[4] |
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