Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Yaskawa XU RSM 53 E 0 Atmospheric Wafer Robot, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | |
|---|---|---|
| OEM | Lapmaster | Yaskawa |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Yaskawa XU RSM 53 E 0 Atmospheric Wafer Robot |
| Specifications | ||
| Make | Lapmaster[1] | — |
| Model | 12[1] | XU RSM 53 E 0[6] |
| Category | CMP[2] | CMP[7] |
| Type/Application | Single sided[3] | — |
| Plate diameter | 12 in[3] | — |
| No. of conditioning rings | 3[4] | — |
| Configuration | Ring lapper[4] | With XU-CM6180 Controller, Compatible with Ebara FREX 300 CMP[6] |
| Base | Rigid, lightweight, cast aluminum base[4] | — |
| Standard RPM | 60 RPM[4] | — |
| RPM range with variable speed drive | 0-60[4] | — |
| Drive motor - lapper | 0.5 HP[4] | — |
| Drive motor - polisher | 0.75 HP[4] | — |
| Length | 25 in[4] | — |
| Width | 18 in[4] | — |
| Height | 24 in[4] | — |
| Estimated shipping weight | 240 lbs[4] | — |
| Approximate weight | 135 lbs / 61 kg[5] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[5] | — |
| Abrasive feed system | Designed for water or oil based lapping slurries[5] | — |
| Automatic cycle timer | Automatic digital cycle timer[5] | — |
| Ring configuration | Ring lapper[4] | — |
| Ring ID | 4.25 inches[4] | — |
| Equipment type | — | Atmospheric Wafer Robot[6] |
| Wafer size | — | 12 inch[6] |
| Controller | — | XU-CM6180 Controller[7] |
| Compatibility | — | Compatible with Ebara FREX 300 CMP[6] |