Comparison ledger
Lapmaster 120 Continuous, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 120 ContinuousLapmaster | DSS 200 PostOntrak |
|---|---|---|
| OEM | Lapmaster | Ontrak |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 120 Continuous | Ontrak DSS 200 |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | With Hepa Mini-Environment[4] |
| Tool type | — | double-sided PVA scrubber[2] |
| Wafer size range | — | 100mm to 200mm[1] |
| Throughput | — | 45-65 wafers per hour[2] |
| Post-CMP cleaning applications | — | oxide, polysilicon, nitride, tungsten, aluminum and copper[2] |
| Type | — | Double-sided PVA scrubber / post-CMP cleaner[2] |
| Wafer sizes (listing) | — | 8 inch[4] |
| Cleanroom environment (listing) | — | With HEPA mini-environment[4] |
| Brush type | — | Roller PVA[3] |
| Downforce control | — | Yes[3] |
| Drying method | — | Spin + heat lamp[3] |
| NH4OH dispense | — | Yes[3] |