Waferpedia

Comparison ledger

15versusDW 288 Wire Cutting

Lapmaster 15, Meyer Burger DW 288 Wire Cutting, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMLapmasterMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15—
Cited variants—
Specifications
Input Power110 Vac[3]—
Plate Diameter15 inches (381 mm)[4]—
Number of Conditioning Rings3[4]—
Ring ID5.5 inches (140 mm)[4]—
Standard RPM60[4]—
RPM Range (Variable Speed Drive)0-60[4]—
Drive Motor - Lapper0.5 HP (0.37 kW)[4]—
Drive Motor - Polisher0.75 HP (0.56 kW)[4]—
Length25 inches (635 mm)[4]—
Width20 inches (508 mm)[4]—
Height24 inches (610 mm)[4]—
Estimated Shipping Weight285 lbs (129.3 kg)[4]—
Web length—420 mm[2]
Wire speed—25 m/s (1500 m/min)[2]
Wire acceleration—8 m/s² (< 4 s)[2]
Min. wire diameter—100 μm[2]
Max. wire tension—45 N[2]
Rocking principle—Rocking of work piece[2]
Rocking angle—±12°[2]
Wire guide roller axis distance—540 mm[2]
Cutting fluid tank—240 l[2]
Machine dimensions (L × W × H)—3620 × 1780 × 3010 mm[2]
Machine weight—10500 kg[2]
Max. work piece size—Ø 8″ × 420 mm or □ 210 × 420 mm[2]
Max. work piece dimensions (round)—Ø 206 × 420 mm[2]
Max. work piece dimensions (square)—210 × 420 mm[2]
Cutting fluid tank capacity—240 l[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]precision-surface.comprecision-surface.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org