Waferpedia

Comparison ledger

15versusMWS-34SN

Lapmaster 15, Takatori MWS-34SN, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
MWS-34SNTakatori
OEMLapmasterTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Takatori MWS-34SN
Specifications
Input Power110 Vac[1]—
Plate Diameter15 inches (381 mm)[2]—
Number of Conditioning Rings3[2]—
Ring ID5.5 inches (140 mm)[2]—
Standard RPM60[2]—
RPM Range (Variable Speed Drive)0-60[2]—
Drive Motor - Lapper0.5 HP (0.37 kW)[2]—
Drive Motor - Polisher0.75 HP (0.56 kW)[2]—
Length25 inches (635 mm)[2]—
Width20 inches (508 mm)[2]—
Height24 inches (610 mm)[2]—
Estimated Shipping Weight285 lbs (129.3 kg)[2]—
Equipment type—Multi Wire Saw[3]
Line—MWS[3]
Model designation—MWS-34SN[3]
Main material capable of slicing—SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and any other hard brittle material[3]
Processing condition capability—Variable processing conditions such as a thin wire, a high wire tension, a fast wire running, or an extra-long time slicing process[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]takatori-g.co.jptakatori-g.co.jp