Waferpedia

Comparison ledger

15versusMWS 610

Lapmaster 15, Takatori MWS 610, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
MWS 610Takatori
OEMLapmasterTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Takatori MWS 610
Specifications
Input Power110 Vac[1]—
Plate Diameter15 inches (381 mm)[2]—
Number of Conditioning Rings3[2]—
Ring ID5.5 inches (140 mm)[2]—
Standard RPM60[2]—
RPM Range (Variable Speed Drive)0-60[2]—
Drive Motor - Lapper0.5 HP (0.37 kW)[2]—
Drive Motor - Polisher0.75 HP (0.56 kW)[2]—
Length25 inches (635 mm)[2]—
Width20 inches (508 mm)[2]—
Height24 inches (610 mm)[2]—
Estimated Shipping Weight285 lbs (129.3 kg)[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org