Comparison ledger
Laurell H6-15, Laurell H6-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H6-15Laurell | H6-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 300mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell H6-15 | Laurell H6-8 |
| Cited variants | — |
|
| Specifications | ||
| Model | H6-15[2] | — |
| Series | 650-series HL coater system[2] | 650-series HL coater system[1] |
| Maximum wafer size | Up to ø 300mm wafers[2] | — |
| Maximum substrate size | 9" × 9" (229mm × 229mm) substrates[2] | — |
| Maximum rotational speed | 12,000 RPM[2] | 12,000 RPM (based on a 100mm silicon wafer)[1] |
| Controller/software | Wireless tablet featuring Laurell Touch process control software; accompanying PC software Spin 3000 is also mentioned[2] | — |
| Power | 95 to 240VAC, 47/63HZ, ~300 Watts[2] | 95 to 240VAC, 47/63HZ, ~300 Watts[1] |
| Required nitrogen/CDA purge | 60–70 PSIG (4–5 bar)[2] | — |
| Vacuum | 25–28 inches Hg suggested; 4.5 SCFM at 0 inches Hg[2] | 25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[1] |
| Wafer size | up to ø 300mm wafers[2] | — |
| Substrate size | 9" × 9" (229mm × 229mm) substrates[2] | — |
| Speed basis | based on a ø 100mm silicon wafer[2] | — |
| Control software | Laurell Touch process control software with accompanying Spin 3000 PC software[2] | Laurell Touch process control software; Spin 3000 PC software[3] |
| Controller | wireless tablet[2] | — |
| Gas purge | 60–70 PSIG Nitrogen/CDA[2] | — |
| Substrate capacity | — | Up to 7" × 7" (178mm × 178mm) substrates[1] |
| Wafer capacity | — | Up to 200mm wafers[1] |
| N2 process/seal purge | — | 60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[1] |
| Typical process use | — | Solvent, Base or Acid-based processing[3] |
| System type | — | Spin coater[3] |
| Standard chuck | — | Vacuum chuck[3] |
| Standard adapter | — | Fragment adapter[3] |
| Vacuum requirement | — | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[3] |
| Nitrogen/CDA purge pressure | — | 60 to 70 PSIG[3] |
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