Comparison ledger
Logitech EP1, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EP1Logitech | 108TPR Hoffman |
|---|---|---|
| OEM | Logitech | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | 100mm | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech EP1 | PR Hoffman 108T |
| Specifications | ||
| Product family | EP Polishing Pads and Cloths[1] | — |
| Application type | Chemical Mechanical Polishing (CMP)[1] | — |
| Suitable applications | oxide, nitride and copper[1] | — |
| Type | Chemical Mechanical Polishing (CMP) cloths and pads[1] | — |
| Suitable materials | Oxide, nitride and copper[1] | — |
| Product type | Chemical Mechanical Polishing (CMP) polishing cloths and pads[1] | — |
| Applications | oxide, nitride, and copper[1] | — |
| Associated wafer process capacity | up to 100mm/4"[2] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[3] |
| machine class | — | for double-sided planetary lapping & polishing machines[3] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[3] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[3] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[4] |