Comparison ledger
Onto Innovation IVS 380 System, Rudolph E25, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IVS 380 SystemOnto Innovation | E25Rudolph |
|---|---|---|
| OEM | Onto Innovation | Rudolph |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2006– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Onto Innovation IVS 380 System | Rudolph E25 |
| Specifications | ||
| Wafer size | 300mm[1] | 300 mm[2] |
| Metrology capabilities | Overlay, CD, height[1] | — |
| Metrology types | overlay, CD, and height metrology[1] | — |
| Target markets | advanced packaging, compound semiconductor, power devices, RF, MEMS, and LED markets[1] | — |
| Inspection type | — | Automated wafer edge top and edge normal inspection[2] |
| Throughput | — | Greater than 80 WPH[2] |
| Certification | — | Class 1 certified[2] |
| Set-up time | — | Approximately 10 minutes to be fully optimized and production ready[2] |
| Defect imaging | — | On-the-fly color defect image capture[2] |
| Detection and classification | — | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[2] |
| Illumination | — | Brightfield and darkfield illumination available[2] |
| Defect detection and classification | — | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[3] |
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