Waferpedia

Comparison ledger

Plasmalab 100 RIEversus1512e

Oxford Instruments Plasmalab 100 RIE, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Plasmalab 100 RIEOxford Instruments
1512eTegal
OEMOxford InstrumentsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments Plasmalab 100Tegal 1512e
Cited variants
  • Plasmalab 100 Plus[1]
  • Plasmalab 100 RIE (FL)[2]
—
Specifications
Voltage208V, 50/60Hz[3]—
ConfigurationWith VAT PM-5 Adaptive Pressure Controller[3]—
Wafer Size6 inch[3]—
RF GeneratorAdvanced Energy RFX 600A, 600 W @ 13.56 MHz[2]—
Electrode Temperature Range10°C to 80°C[2]—
Turbo PumpAlcatel ATH 400M[2]—
Turbo Pump ControllerAlcatel ACT 600M[2]—
Pressure ControllerVAT PM-5 Adaptive Pressure Controller[3]—
Number of Gas Lines6 (with MFCs)[2]—
Installed GasesAr, N2, CHF3, NF3, N2O[2]—
ChillerThermo Neslab RTE7 Chiller and OptiTemp OTI-5WL-P3-216 Chiller[3]—
Vacuum PumpLeybold D65BCS Vacuum Pump with oil filter and exhaust filter[3]—
Control SystemWindows PC with user-friendly interface and blue PLC control architecture[2]—
Platen Size330 mm platen[2]—
Load-lockedYes[1]—
Tool type—Industrial RIE plasma etcher system[4]
Stated configuration—With modules assembly for CI-4222[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]classoneequipment.comclassoneequipment.com
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com