Comparison ledger
Palomar 3880, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3880Palomar | 10100West Bond |
|---|---|---|
| OEM | Palomar | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Palomar 3880 | West Bond 10100 |
| Specifications | ||
| Machine type | Component placement die attach system[1] | — |
| Bond head | Integrated Z-Theta bidirectional 8-tool bond head[1] | — |
| Capabilities | Supports eutectic and epoxy die attach, flip chip, and a range of options in a single machine[1] | — |
| Process types listed | Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding[1] | — |
| Machine use in services | Used for wafer (up to 12") deep access wafer sealing applications[2] | — |
| Supported process | Eutectic die attach[1] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →