Waferpedia

Comparison ledger

003163-000 SRDversusGT200

Semitool 003163-000 SRD, SUSS MicroTec GT200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GT200SUSS MicroTec
OEMSemitoolSUSS MicroTec
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemitool 003163-000 SRDSUSS MicroTec GT200
Specifications
MakeSemitool[1]—
Model003163-000[1]—
Equipment typeSpin Rinse Dryer (SRD)[1]—
Asset #139375[1]—
Last Confirm DateSeptember 03, 2025[1]—
Chemical consumption—Significantly lower compared to conventional processes[2]
Hazardous acids—None used[2]
Organic solvents—None used[2]
Wafer size—up to 200 mm[3]
Throughput—up to 45 wafers per hour[3]
Particle removal efficiency—99% for particles >100 nm[3]
Available modules—TurbulenStrip, CrustBuster, SpinRinseDry[4]
General dimensions (w x d x h)—237 x 420 x 230 cm[4]
Supported wafer materials—Si, SiC, and more[4]
Robot system—dual arm robot[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]suss.comsuss.com
  3. [3]suss.comsuss.com
  4. [4]suss.comsuss.com