Comparison ledger
Shinkawa 8-inch, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8-inchShinkawa | 10100West Bond |
|---|---|---|
| OEM | Shinkawa | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 8-inch | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Shinkawa 8-inch | West Bond 10100 |
| Cited variants |
| — |
| Specifications | ||
| Application | Mold CSP, Wafer Level CSP[1] | — |
| Function | Package sorter for diced solid mold CSP and wafer level CSP[1] | — |
| Sorting method | Diced packages attached on tape are sorted very quickly in a tray[1] | — |
| Flip mechanism | Available with a flip mechanism that attaches the ball upside down for live-bug style[1] | — |
| Sorting speed | 0.5 s/package[1] | — |
| Inline processing | In-line processing with dicer (option)[1] | — |
| Variant | DPS-260, unloader added version also available[1] | — |
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