Waferpedia

Comparison ledger

Multiplex ICP Advanced Oxideversus1512e

STS Multiplex ICP Advanced Oxide, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMSTSTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySTS Multiplex ICPTegal 1512e
Specifications
Voltage208 V[1]—
Configuration80 A[1]—
Frequency60 Hz[1]—
RF GeneratorsENI ACG10B 1kW (13.56MHz)[1]—
Clamp TypeStandard WTC[1]—
Platen TypeDomed[1]—
Turbo PumpNone[1]—
MACs RobotNone[1]—
Pumping SystemNone[1]—
Tool type—Industrial RIE plasma etcher system[2]
Stated configuration—With modules assembly for CI-4222[2]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com