Waferpedia

Comparison ledger

GT200versus1000P

SUSS MicroTec GT200, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GT200SUSS MicroTec
OEMSUSS MicroTecYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilySUSS MicroTec GT200YES 1000P
Specifications
Chemical consumptionSignificantly lower compared to conventional processes[1]—
Hazardous acidsNone used[1]—
Organic solventsNone used[1]—
Wafer sizeup to 200 mm[2]—
Throughputup to 45 wafers per hour[2]—
Particle removal efficiency99% for particles >100 nm[2]—
Available modulesTurbulenStrip, CrustBuster, SpinRinseDry[3]—
General dimensions (w x d x h)237 x 420 x 230 cm[3]—
Supported wafer materialsSi, SiC, and more[3]—
Robot systemdual arm robot[3]—
Model—1000P[4]
System type—Plasma cleaning system[4]
Shelf configuration—Four 16 x 16 inch shelves[4]
Total capacity—1024 square inches[4]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[4]
Number of shelves—4[4]
Shelf size—16 x 16 inches[4]
Power—1000 W[5]
Configuration—Parallel plate[5]
Operation modes—Active, RIE, Downstream[4]
Sample size range—From smallest semiconductor chip to large flat panels[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com
  2. [2]suss.comsuss.com
  3. [3]suss.comsuss.com
  4. [4]web.archive.orgweb.archive.org
  5. [5]semistarcorp.comsemistarcorp.com