Comparison ledger
Tegal 6550, Tegal 900, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 6550Tegal | 900Tegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | 2000 | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2000 Patent announcement · 2001 Order announced | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 6550 | Tegal 900 |
| Cited variants |
| |
| Specifications | ||
| Product type | etch reactor / plasma etch system[3] | — |
| Wafer size | 100mm–200mm[1] | 3", 100mm–150mm[2] |
| Process target | non-volatile metal and metal oxide films[3] | — |
| Primary application | volume production of magnetic memory components such as MRAM and GMR devices[3] | — |
| Platform | full cluster tool technology[3] | — |
| Process capability | patented rinse-strip-rinse feature / process capability[3] | — |
| Chamber configuration | dual-chamber platform[4] | — |
| Plasma source | patented next-generation dual-frequency plasma source technology[3] | — |
| Plasma source (later material) | Spectra plasma source[4] | — |
| Available option | deposition shield[3] | — |
| Type | plasma etch reactor[3] | plasma etch system[5] |
| Processes | etching non-volatile metal and metal oxide films[3] | — |
| Plasma source technology | patented next-generation, dual-frequency plasma source technology[3] | — |
| Variant | Spectra plasma source[4] | — |
| Product line | — | 900 Series plasma etch system[5] |
| Substrate handling | — | Handles both round and square substrates[5] |
| Use case | — | Defreckling and backside nitride etching[5] |
| Process type | — | Single wafer plasma RIE[2] |
| Applications | — | defreckling and backside nitride etching[5] |
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