Comparison ledger
YES 450 PB 12 Polyimide, YES PBV-300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PBV-300YES | |
|---|---|---|
| OEM | YES | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | YES 450 | YES PBV-300 |
| Specifications | ||
| Wafer size | Capacity is two 25 wafer cassettes in a batch process (50 wafers at a time) - 300mm FOUP[1] | 300mm and 200mm[4] |
| Chamber Material | 316L Stainless Steel[1] | — |
| Operation Temperature | ambient to 450°C (option high temp version: Ambient to 550°()[1] | — |
| Process Gas Inputs | 1 standard up to 3 optional[1] | — |
| Configuration | Preheated N, (Process Gas)[1] | — |
| Mass Flow Controllers | optional, up to 3[1] | — |
| Laminar Flow Filter | 100 micron Mott'" plate filter[1] | — |
| Cleanliness | particle reduction in most applications[1] | — |
| OEM | YES[1] | — |
| Model | 450 PB 12[1] | — |
| Category | Thermal / Diffusion[2] | Thermal / Diffusion[5] |
| Capacity | Two 25-wafer cassettes in a batch process (50 wafers at a time)[1] | — |
| FOUP compatibility | 300mm FOUP[1] | — |
| Wafer handling | Uses wafer cassette; wafers are manually brought to the machine and loaded inside[1] | — |
| Operation temperature | Ambient to 450°C[1] | — |
| Gas delivery | 1 standard up to 3 optional[2] | — |
| Process gas | Preheated N2[1] | — |
| Vacuum | Alternate vacuum valve for process vacuum[2] | — |
| Vacuum plumbing | VCR[2] | — |
| Number of Recipes | 8 temperature profiles (up to 200 with YES - DAQ-LR option)[1] | — |
| Temperature | Ambient to 450°C with LED temperature and set point displays[1] | — |
| Voltage | 208V, 3 Phase 50/60 Hz, 40 amps[1] | — |
| Oxygen Concentration | 10 ppm over background[1] | — |
| Automation | — | Automated[3] |
| Process family | — | Polyimide/BCB Vacuum Cure Ovens[3] |
| Associated process applications | — | polyimide, BCB, low-k dielectrics and copper anneal[3] |
| Manufacturer | — | YES[5] |
| Processing range | — | 300mm and 200mm[4] |
| System type | — | Fully automated 300mm and 200mm polyimide/BCB/copper anneal/vacuum bake system[4] |
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