Waferpedia

Comparison ledger

UF 300versusUF 300 A Automatic Wafer

Accretech UF 300, Accretech UF 300 A Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UF 300Accretech
OEMAccretechAccretech
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2001 Vintage
Control system——
Generation——
FamilyAccretech UF 300Accretech UF 300
Cited variants
  • UF 300 A Automatic Wafer[1]
—
Specifications
ConfigurationIncludes Loader[2]Nickel chuck[4]
OCRYes[2]—
InterfaceGPIB[2]—
Cleaning PadYes / Ceramic[2]—
Chuck ControllerAmbient to 125°C[2]—
XY Position AccuracyYes[2]—
Needle AlignmentYes[2]—
Auto Needle Height SettingYes[2]—
GPIBYes[2]—
Auto AlignmentYes, Needle & Wafer[2]—
Wafer LoaderFoup & Inspection Tray[2]—
ManufacturerAccretech / TSK[2]—
ModelUF 300[2]UF 300 A[4]
CategoryTest & Probe[3]—
Wafer sizes8 inch, 12 inch[2]—
Includes loaderYes[2]—
Chuck12 inch chuck[2]Nickel chuck[4]
Color LCR displayYes[2]—
Operator terminal & keyboardIncluded[2]—
Power cord for proberIncluded[2]—
Floppy disk with configuration filesIncluded[2]—
Backup of configuration filesOn internal hard drive inside the prober[2]—
Power CordIncluded[2]—
Backup of Configuration Files on Internal Hard DriveIncluded[2]—
Phase—1 Phase[4]
Cognex board type—8200[5]
Voltage—208V[5]
OEM—Accretech / TSK[4]
Equipment type—Automatic Wafer Prober[4]
Wafer size—8 inch[4]
Power—1 Phase[4]
Vintage—2001[4]
Keyboard/joystick—Keyboard, joystick[5]
Storage—3.5" floppy disk / 3.5" hard disk[5]
Printer—Internal printer[5]
Interfaces—GPIB I/F, RS232 I/F, Ethernet I/[5]
Functions—Probe mark inspection; automatic probe to pad alignment; multi-die probing up to 256 DUTs; multi function cleaning pad; automatic needle height alignment; soak time option; new E2 camera update[5]
Chuck Type—Nickel chuck (some units) or gold plated chuck (other units)[5]
Automation—Fully automatic[5]
Probe Card Change—Included[5]
User Interface—Keyboard, joystick, 3.5" floppy disk / hard disk, internal printer[5]
Vision System—Cognex board type 8200, New E2 camera update[5]
Probing Features—Multi-die probing up to 256 DUTs, automatic probe to pad alignment, probe mark inspection, automatic needle height alignment[5]
Cleaning—Multi function cleaning pad[5]
Soak Option—Soak time option[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]inventory listing