Comparison ledger
ADT 7200 Dicing, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 7200 DicingADT | 3220Disco |
|---|---|---|
| OEM | ADT | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2013 Manufactured | — |
| Control system | — | — |
| Generation | — | — |
| Family | ADT 7200 Dicing | Disco 3220 |
| Cited variants |
| — |
| Specifications | ||
| Model | 7200[2] | — |
| Equipment type | Dicing Saw[2] | — |
| Wafer size | 8 inch[2] | — |
| Vintage | 2005[2] | — |
| Year of manufacture | 2013[1] | — |
| Power requirement | 240V[1] | — |
| Application | High-accuracy scribing and dicing of silicon wafers, ceramics, glass, and compound semiconductors[1] | — |
| Features | Precision blade spindle; integrated alignment and vision system; motorized X-Y stage; automatic depth control; touchscreen or PC interface[1] | — |
| equipment type | — | dicing saw[4] |
| Workplace size | — | ø150 mm[5] |
| Spindle layout | — | Single[5] |
| Spindle output | — | 1.5 kW at 30,000 min-1[5] |
| Spindle max revolution speed | — | 40,000 min-1[5] |
| X-axis feed speed range | — | 0.1 – 500 mm/s[5] |
| Y-axis index step | — | 0.0001 mm[5] |
| Z-axis repeating accuracy | — | 0.001 mm[5] |
| Z-axis max blade size | — | ø58 mm[5] |
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