Waferpedia

Comparison ledger

0010-03254 E ChuckversusCM 300 xi

Applied Materials 0010-03254 E Chuck, FormFactor CM 300 xi, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
CM 300 xiFormFactor
OEMApplied MaterialsFormFactor
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—FormFactor CM 300 xi
Cited variants—
Specifications
OEM—FormFactor[2]
Model—CM 300 xi[2]
Product type—300 mm semi-/fully-automated probe system[3]
Wafer size—300 mm[3]
Automation—Semi-automated and fully-automated[3]
Contact Intelligence—Supported[3]
Wafer handling capacity—Up to fifty 200 mm or 300 mm wafers[3]
Cassette type—SEMI-standard wafer cassettes[3]
Optional alignment feature—ReAlign off-axis probe-to-pad alignment[3]
Temperature range—-60°C to +300°C[3]
MicroChamber environment—EMI-shielded, light-tight and moisture-free test environment[3]
Variant designation—CM300xi-ULN[1]
ULN product type—300 mm probe station for ultra low noise measurements[1]
Sources (3)Every fact above is drawn from these public sources
  1. [1]formfactor.comformfactor.com
  2. [2]Equipment inventory listing
  3. [3]formfactor.comformfactor.com