Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal IC/5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | IC/5Temescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal IC/5 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| product type | — | Multi-process deposition controller[2] |
| application | — | Deposition controller for e-beam systems[3] |
| process type | — | Evaporation and other physical vapor deposition (PVD) processes[3] |
| software and I/O | — | Enhanced software and logic I/O features[3] |
| process storage | — | Up to 50 processes[2] |
| layer storage | — | 250 total layers[2] |
| extended storage | — | Unlimited with the floppy disk option[2] |
| data logging | — | Stores layer and process data in ASCII format for post-run analysis[2] |
Plan your fab
Building a Deposition process? Get a complete equipment list.
Open the fab equipment planner →