Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, CyberOptics SE500-II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | SE500-IICyberOptics |
|---|---|---|
| OEM | Applied Materials | CyberOptics |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | CyberOptics SE500-II |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | — |
| Board Size (Max.) | — | 510 x 510 mm[2] |
| Board Size (Min.) | — | 50 x 50 mm[2] |
| Inspection Speed @ 30µm | — | 80cm²/sec[2] |
| Inspection Speed @ 15µm | — | 50cm²/sec[2] |
| Gage R&R | — | <10%, 6σ[2] |
| Sensor | — | Exclusively designed and built by CyberOptics[2] |
| Scan sequence | — | Unique 'all-in-one' scan sequence[2] |
| Software | — | SPI V5 software[2] |
| Board Edge Clearance (Top) | — | 2.5 mm (0.10 in.)[3] |
| Board Edge Clearance (Bottom) | — | 3.0 mm (0.12 in.)[3] |
| Component Clearance (Top above belt) | — | 20.1 mm (0.78 in.)[3] |
| Component Clearance (Bottom) | — | 25.4 mm (1.0 in.)[3] |
| Conveyor Speed | — | 150 - 450 mm/sec (5.9-17.7 in./sec)[3] |
| Dimensions | — | 39.5" x 50" x 55" H[3] |
| Weight | — | 1,433 lbs[3] |
| Inspection type | — | 3D solder paste inspection[3] |
| Max board size | — | 510 x 510 mm[2] |
| Min board size | — | 50 x 50 mm[2] |
| Conveyor speed | — | 150 - 450 mm/sec[3] |
| Conveyor width adjust | — | Automatic SMEMA[3] |
| Board edge clearance top | — | 2.5 mm[3] |
| Board edge clearance bottom | — | 3.0 mm[3] |
| Component clearance top (above belt) | — | 20.1 mm[3] |
| Component clearance bottom | — | 25.4 mm[3] |
| Condition wording | — | Complete & Operational[4] |
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