Waferpedia

Comparison ledger

0010-21246 PartversusMY 600 Jet

Applied Materials 0010-21246 Part, MyData MY 600 Jet, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
OEMApplied MaterialsMyData
Category——
Wafer size——
Process node——
Introduced——
Production run—2014–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—MyData MY 600 Jet
Specifications
Manufacturer—MyData[1]
Model—MY 600 Jet[1]
Equipment type—Printer[1]
Application—Stencil-free application of solder paste onto PCBs[2]
Throughput—More than one million dots per hour[2]
Platform description—Next-generation jetting platform[2]
Machine type—Printer[1]
Throughput increase versus previous models—50 percent increase[2]
Function—Stencil-free application of solder paste onto PCBs[2]
Throughput increase vs previous models—50 percent increase[2]
Vintage—2014[1]
Acceleration—3G[3]
Base weight—2000 kg casted granite[3]
Beam material—lightweight carbon fiber[3]
Motion system—direct drive motors with high-precision linear encoders[3]
Jetting technology—non-contact jetting nozzle, no z-axis movement[3]
Software—self-learning data preparation system, graphical editor, auto-match function[3]
Data input—CAD or Gerber data[3]
Changeover time—less than one minute[3]
Product type—Printer[1]
Operating mode—In-line or stand-alone[3]
Control platform—100% software-driven[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]mycronic.commycronic.com
  3. [3]as-equipment.deas-equipment.de