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Comparison ledger

0041-26723 Bonded Assemblyversus2200 EVO Flexible Multi-Chip

Applied Materials 0041-26723 Bonded Assembly, Besi 2200 EVO Flexible Multi-Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsBesi
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer Table
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyBesi 2200
Specifications
Wafer size—Wafer Table[1]
Configuration—Tool Changer Unit 7 Slots[2]
OEM—Besi / Datacon[2]
Model—2200 EVO Flexible Multi-Chip[2]
Category—Packaging & Bonding[1]
Vacuum—Internal Vacuum Pump[1]
Tool changer—Unit 7 Slots[2]
Main unit—Musashi Super Sigma V2[2]
Axis component—P-part at Main AXIS[2]
Optics—Microscope[2]
Adapter—12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4")[2]
WP-adapter—2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT)[2]
GP-adapter—2" GP-Adapter - (12"-FF123) - 22 up - (any WT)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing