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Comparison ledger

E 500 EHPI Medium CurrentversusNV 8250

Applied Materials E 500 EHPI Medium Current, Axcelis NV 8250, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Ion Implantation, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
E 500 EHPI Medium CurrentApplied Materials
NV 8250Axcelis
OEMApplied MaterialsAxcelis
CategoryIon ImplantationIon Implantation
Wafer sizeWafer Position Detect—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials E 500Axcelis NV 8250
Specifications
Loading ConfigurationOpen Cassette[2]—
SoftwareV 13.30 rev D[3]—
Floppy Drive Type3.5"[3]—
ConfigurationCE Mark[3]Backside[4]
Energy Range10 KeV - 200 KeV[2]0-250 keV[1]
Solid State Scanner30 KV[3]—
Gas Box TypeHP[2]—
Computer TypePentium[3]—
OEMApplied Materials / Varian[3]—
ModelE 500 EHPI[2]—
CategoryIon Implantation[2]—
Wafer Sizes6 inch[3]8 inch[1]
Load Lock TurboV 300 HT[3]—
Source Zone Turbo PumpSTP 1000[3]—
Scanner Turbo PumpSTP 1000[3]—
Analyzer Turbo PumpV 300 HT[3]—
Vacuum Pumps (3)Edwards QDP 80, QMB 250[3]—
Pump TypeDry[3]—
Wafer sizeWafer Position Detect[3]—
Wafer size / detectWafer Position Detect[2]—
ScannerSolid State Scanner, 30 KV[3]—
Control interfaceGEM/SECS; SECS II Interface[3]—
Power Requirement—208 VAC, 100 A, 50/60 Hz, 3 Phase[1]
Programmable Auto Tilt—0-75 degrees[1]
Single Stage Extraction—15-40 keV[1]
Ion Source Type—ELS[1]
Source Material Type—Moly[1]
Electrostatic Chuck (ESC)—Yes[1]
Parallel Beam using Hybrid Scanning—Yes[1]
90 degrees Radially Indexed Dipole Magnet—Yes[1]
Signal Tower—Yes[1]
SECS II / GEM Interface—Yes[1]
Cassette Interface—Asyst Bolt-On SMIF (2), Cassette Stages (3), Automatic Flat/Notch Alignment, Programmable Flat Orient[1]
Controller—Sun Sparc Station V, Application SW Ver. 4.3.2, Auto Start-Up & Computer Monitoring[1]
Pump / Cryogenics—Source Pump: TMP; Beam Pump: TMP (2) and Cryo Pump (8" Torr, Non On-board); End Station Pump: 2 Cryo Pump (8" Torr, Non On-Board); Cryo Compressor: CTI 8500; Remote Disk Chiller[1]
Gas Configuration—AsH3 - SDS, PH3 - SDS, BF3 - SDS, Ar - HP[1]
Energy Filter System Option—Yes[1]
Vintage—1999 (Backside)[4]
Source Pump—TMP[1]
Beam Pump—TMP (2)[1]
End Station Pump—2 Cryo Pump (8" Torr, Non On-Board)[1]
Cryo Compressor—CTI 8500[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]inventory listing