Waferpedia

Comparison ledger

Mirra 3600versus15 Lapper

Applied Materials Mirra 3600, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Mirra 3600Applied Materials
15 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials MirraLapmaster 15
Specifications
ConfigurationMissing parts[1]Equipped with:[2]
Number Of Conditioning Rings—Up to 3[2]
Ring ID—Up to 5.5″[2]
Plate Diameter – Outside—15″[2]
Plate Diameter – Inside—3 1/2″[2]
Standard RPM—60[2]
Drive Motor—1/2 HP[2]
Electrics—110V / 1Ph / 60Hz[2]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[2]
Equipped with: 15″ Cast Iron Plate—Included[2]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[2]
Equipped with: (3) Conditioning Rings—Included[2]
Equipped with: (3) Hold Downs—Included[2]
Equipped with: 30 Minute Timer—Included[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing