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Comparison ledger

AB 559 A 06 WedgeversusAsterion SV Hybrid Wedge

ASM AB 559 A 06 Wedge, Kulicke & Soffa Asterion SV Hybrid Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Packaging & Bonding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
OEMASMKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AB 559Kulicke & Soffa Asterion
Specifications
Configuration50/60 Hz[1]50/60 Hz[3]
Software vs2.42[2]—
Machine typeWedge Bonder[1]—
MakeASM[1]—
ModelAB 559 A 06[1]—
Frequency50/60 Hz[1]—
Voltage240 Volts[1]—
Vintage2005[1]—
Software version2.42[2]—
P/N—AST-SV[3]
Bondable Area—300 mm x 95 mm[3]
Current Rating of Largest Loads—3 A[3]
Air Pressure—40-145 PSI. 2-10 L/min (small wire only)[3]
Inrush Current—80 A / 10 mSec[3]
Main Protection Rating—10 A[3]
SCCR—5 kA[3]
Power—50/60 Hz[4]
Key Features—Expanded Bonded Area; Direct-drive Motion System; Advanced Software Suite; Large Wire Spool Compatibility[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com