Comparison ledger
ASM M Feeder II, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | M Feeder IIASM | 101-149-053 Gold BoosterBranson |
|---|---|---|
| OEM | ASM | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM M Feeder II | Branson 101-149-053 Gold Booster |
| Specifications | ||
| Configuration | Configured for Manual Panel Loading[1] | 1:1.5[2] |
| Bondhead Type | Single bondhead with 4 arms[1] | — |
| System performance - XY placement | ± 0.4 mil (10 um) @ 3g[1] | — |
| System performance - Die rotation | ±1° @ 3g[1] | — |
| System performance - Global array angle | ±0.01o[1] | — |
| System performance - Bonding cycle | 72 ms[1] | — |
| Die size | 90 x 90 - 500 x 500 um[1] | — |
| Die thickness | 3.5 x 3.5-19.7 x 19.7 mil / Min 50 um[1] | — |
| Input material | Standard JEDEC tray[1] | — |
| No. of tray handling | 2[1] | — |
| Carrier size | Max 60 x 60 x 1.5mm (With 50 x 50mm effective bonding area)[1] | — |
| Wafer type | Foton ring[1] | — |
| Wafer ring size (OD) | 7.33"[1] | — |
| Expanded wafer size | 5.9"[1] | — |
| PR system - Image mode | Color[1] | — |
| PR system - Grey level | 256 grey level[1] | — |
| Voltage | 220 Vac, Single Phase[1] | — |
| Optional voltage | 110 Vac[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Compressed air | 6 bar[1] | — |
| Air consumption | 700 LPM @ 6bar[1] | — |
| Vacuum pump | Option[1] | — |
| Full load current | 24A @ 220V[1] | — |
| Manufacturer | — | Branson[3] |
| Model | — | 101-149-053[3] |
| Type | — | Gold Booster[3] |
| Operating frequency | — | 20 kHz[4] |
| Gain | — | 1:1.5[3] |
| Mounting thread | — | 1/2-20[4] |
| Length | — | 5.4 in[4] |
| Gain ratio | — | 1:1.5[3] |
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