Comparison ledger
ASML NXE 3400 B EUV, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NXE 3400 B EUVASML | 101EV Group |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML NXE 3400 B EUV | EV Group 101 |
| Specifications | ||
| Wafer size | 300 mm (12 inch)[1] | — |
| Node support | 7 nm, 5 nm[2] | — |
| Numerical aperture (NA) | 0.33[2] | — |
| Throughput (wafers per hour) | ≥ 125 (at 20 mJ/cm², die size 26×33 mm, 96 shots)[2] | — |
| Exposure field size | 26 × 33 mm[2] | — |
| Dedicated chuck overlay | 1.4 nm[2] | — |
| Matched-machine overlay | 2 nm[2] | — |
| Sigma range | 0.06 – 1.0[2] | — |
| Reduction factor | 4x[2] | — |
| Level sensor type | UV light based (same as NXE:3350B)[2] | — |
| OEM | — | EV Group[3] |
| Model | — | 101[3] |
| Equipment name | — | EVG 101 Spray Coater[3] |
| NEMO ID | — | evgspraycoat[3] |
| Training required | — | EVG 101 Training[3] |
| Training duration | — | 1.50 hours[3] |
| Processing technique | — | Resist Spray Coat (manual)[3] |
| Cleanliness | — | "All"[3] |
| Location | — | SNF Paul G Allen L107 Cleanroom[3] |
| Wafer diameter (substrate size) | — | up to 300 mm[4] |
| Available modules | — | Spin coat / OmniSpray® / develop[4] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[4] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[5] |
| Cleanliness group (at SNF) | — | "All"[3] |
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