Waferpedia

Comparison ledger

200 ACUversusAK 800

Axcelis 200 ACU, Meyer Burger AK 800, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
AK 800Meyer Burger
OEMAxcelisMeyer Burger
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Meyer Burger AK 800
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
1. Magnetron head—Muegge 3kW
8. Gas box—BCl3, Cl2, C4F8, CF4, CF3H,
19. Dry pump—Ebara EV-S100P
20. Dry Pump—Ebara EV-M202N-
Vintage—2015
Etch/Asher Vintage—2015

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com