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Comparison ledger

200 ACUversusPlasmalab 100 ICP 180 RIE

Axcelis 200 ACU, Oxford Instruments Plasmalab 100 ICP 180 RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Plasmalab 100 ICP 180 RIEOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Oxford Instruments Plasmalab 100
Specifications
ConfigurationParts Machine[1]With VAT PM-5 Adaptive Pressure Controller[5]
ManufacturerAxcelis[1]Oxford Instruments[5]
Model200 ACU[1]Plasmalab 100 ICP 180[5]
Tool typeAsher[1]Reactive Ion Etcher[5]
Wafer size200mm[3]6 inch[5]
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Voltage—208V, 50/60Hz[5]
Category—Etch[6]
Power—208V, 50/60Hz[5]
Adaptive pressure controller—VAT PM-5[5]
Turbopump controller—Adixen ACT 1300M[5]
Vacuum pump—Leybold D65BCS with oil filter and exhaust filter[5]
Gas delivery—Gas Box[5]
Control computer—Control Computer (no HDD)[5]
Monitor—LCD Monitor[5]
Chiller—Thermo Neslab Chiller[5]
Computer cart—Computer Cart[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com