Waferpedia

Comparison ledger

20 36 SurfaceversusDFG 8830

Blanchard 20 36 Surface, Disco DFG 8830, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFG
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]In-Feed[2]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Phase—3 Phase[2]
Wafer size—6 inch, 8 inch[2]
Material—SiC (silicon carbide)[2]
Max workpiece size—ø150 mm[3]
Spindle quantity—4[3]
Spindle power (Z1–Z3)—6.3 kW[3]
Spindle speed (Z1–Z3)—1,000–4,000 min⁻¹[3]
Work disc quantity—5[3]
Dimensions (W×D×H)—1,400 × 2,500 × 2,000 mm[3]
Weight—≈6,000 kg[3]
Maximum workpiece size—150 mm (6 inch)[3]
Wafer sizes supported—6 inch and 8 inch[2]
Spindle count—4[3]
Spindle speed range—1,000 – 4,000 min⁻¹[3]
Number of work stations—5[3]
Dimensions (W x D x H)—1,400 x 2,500 x 2,000 mm[3]
Material compatibility—SiC[2]
In-feed capability—Yes[2]
Power supply—3 Phase, 3 Wire + Ground, 60 A[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org