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Comparison ledger

101-149-053 Gold BoosterversusLSB959

Branson 101-149-053 Gold Booster, Hesse & Knipps LSB959, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
LSB959Hesse & Knipps
OEMBransonHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterHesse & Knipps LSB959
Specifications
Configuration1:1.5[1]—
ManufacturerBranson[2]—
Model101-149-053[2]—
TypeGold Booster[2]Fully automatic heavy wire bonder with thermosonic function[4]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Machine type—Fully automatic heavy wire bonder with thermosonic function[5]
Process capability—Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[5]
Working area—370 mm x 560 mm x 42 mm[5]
P-rotation—440°[5]
Bondhead frequency—60 kHz, alternative frequencies on request[5]
Wire size—Cu: 300 μm – 500 μm, other sizes on request[5]
Laser—IR fiber laser with power up to 130W[5]
Temperature output—Programmable temperature output[5]
Footprint—805 mm x 1634 mm x 1912 mm[5]
Weight—Approx. 1300 kg[5]
Safety classification—Laser class 1[5]
Monitoring—Continuous real time monitoring of wire deformation, transducer current, frequency, and bond tool temperature within programmable control limits[5]
Quality control—Process integrated Quality Control (PiQC) is stated as an option[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]hesse-mechatronics.comhesse-mechatronics.com
  5. [5]hesse-mechatronics.comhesse-mechatronics.com