Comparison ledger
CEE 200 Bake Plate, YES 8-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8-2P-CPYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | YES 8-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Wafer size | up to 200mm wafer[2] | 200 mm wafers[1] |
| Software | Internal OS[2] | — |
| Voltage | 208V[2] | — |
| Wafer Size | up to 200 mm[3] | — |
| Maximum Temperature | 300 °C[3] | — |
| Bake Methods | Hard contact, Proximity (lift 25-100 μm using N2)[3] | — |
| Exhaust Cover | Yes (removal of fume)[3] | — |
| Smart Pins for Temperature Control | Yes[3] | — |
| Model | — | 8-2P-CP[1] |
| Series | — | YES-PB Series[1] |
| Load type | — | manual load[4] |
| Process interface | — | touch screen interface enables the process to be fully automated[4] |
| Cooling package | — | uses air, no water[4] |
| Airflow | — | vertical laminar airflow[4] |
| Condensate control | — | coalescing condensate trap assembly[4] |
| Process type | — | manual-load high-temperature cure oven[4] |
| Applications | — | Polyimide/PBO cure; BCB bake; Low temp polymers cure; Copper anneal; Low-K dielectric cure; Copper oxide removal; Aluminum anneal[4] |
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