Comparison ledger
CEE 300 Bake Plate, YES 58TA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 58TAYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | YES 58TA |
| Cited variants | — | |
| Specifications | ||
| Wafer size | up to 300mm wafer[2] | — |
| Software | Internal OS[2] | — |
| Voltage | 208V[2] | — |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[3] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[3] | — |
| Power | 3100-4100 watts[3] | — |
| Exhaust Port | 2" (50.8mm) OD[3] | — |
| Operation temperature | — | ambient to 180 °C[4] |
| Image reversal bake throughput | — | 1 load/hour[4] |
| Vacuum bake/vapor prime throughput | — | 2 loads/hour[4] |
| Wafer handling | — | handles wafers up to 300 mm[4] |
| Process control | — | fully programmable process time and temperature[4] |
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