Comparison ledger
CHA SE600, SUSS MicroTec DSC300 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SE600CHA | DSC300 Gen2SUSS MicroTec |
|---|---|---|
| OEM | CHA | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | Gen2 |
| Family | CHA SE600 | SUSS MicroTec DSC300 Gen2 |
| Specifications | ||
| Tool type | Electron Beam Lithography System[1] | — |
| Substrate range | 10 mm pieces up to 300 mm wafers[1] | — |
| Minimum feature size | less than 10 nm[1] | — |
| Equipment type | Electron beam evaporator[2] | — |
| Alternate description | Gold evaporator[3] | — |
| Manufacturer | CHA[2] | — |
| Part number | SE600[3] | — |
| Unit vintage date | 01.06.1980[2] | — |
| Type | — | Automated system[4] |
| Wafer size | — | up to 300 mm[4] |
| Process category | — | Projection lithography[4] |
| Exposure technology | — | Full-field scanning projection[4] |
| Alignment | — | Yes[4] |
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