Comparison ledger
Disco DFG 841 Grinder Lapper, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 108TPR Hoffman | |
|---|---|---|
| OEM | Disco | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables. | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG 841 | PR Hoffman 108T |
| Specifications | ||
| Spindle Speed (Max) | 7,000 rpm[1] | — |
| Power | AC 200V, 50/60 Hz, 3-Phase, 17 kVA[1] | — |
| Air Requirement | 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)[1] | — |
| Cutting Water | 0.2 MPa (2 kgf/cm²), 15 L/min[1] | — |
| Cooling Water | 0.2 MPa (2 kgf/cm²), 11 L/min[1] | — |
| Grinding Method | In-feed grinding with wafer rotation[1] | — |
| Accuracy | Planarity ≤ 1.5 µm across wafer[1] | — |
| Configuration | Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).[1] | — |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables.[1] | — |
| Spindle options | Configurable for coarse + fine grind[1] | — |
| Make | Disco[1] | — |
| Model | DFG 841[1] | — |
| Tool type | Grinder / Lapper / Polisher[1] | — |
| Planarity accuracy | ≤ 1.5 µm across wafer[1] | — |
| Vacuum coolant unit | Provides cooling and chip removal; separate floor-standing unit[1] | — |
| Chiller unit | Stabilizes grinding fluid temperature[1] | — |
| Filter unit | For grinding water/coolant circulation[1] | — |
| Robot unit | Automated wafer handling between cassettes and chuck tables[1] | — |
| Transformer | 20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)[1] | — |
| Electrical compartment | Control and power distribution[1] | — |
| Chuck tables | Two chuck tables, porous vacuum type[1] | — |
| Cassette handling | Automatic cassette loading/unloading with same-cassette return[1] | — |
| Wafer thickness measurement | Contact gauge system[1] | — |
| Control/software | With HDD and Software[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[2] |
| machine class | — | for double-sided planetary lapping & polishing machines[2] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[2] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[2] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[3] |